Broadcom, a provider of semiconductors for wired and wireless communications, has launched new single-chip HSPA (high-speed packet access) baseband processor and a radio frequency transceiver offering that integrates 3G cellular and mobile technologies for powering the 3G smartphone and smart feature phone product segments.
The company said that the new baseband processor provides cellular connectivity with built-in graphics capabilities for HSUPA (high speed upstream packet access) applications. The RF transceiver offering provides support for all frequency combinations covering the new 3G-enabled devices.
The ‘3G phone-on-a-chip’ and RF offering, designed in the company’s 65 nanometer CMOS process, enables manufacturers to build 3G HSUPA phones with sleek form factors and long battery lives, Broadcom said.
Utilising an integrated ARM11 processor that is capable of running open operating systems (such as Windows Mobile and Android), the BCM21553 HSUPA baseband processor can run new applications and download media files at faster speed. It enables the next generation of smartphones by supporting 3GPP releases 6 and 7, which provide up to 5.8Mbps of upstream connectivity, 7.2Mbps of downstream connectivity and support next generation CS over HSPA services.
In addition, the processor includes the company’s PRISM technology and integrates 3D graphics core with support for the OpenGLA ES 2.0 graphics standard. It supports Windows Mobile and Android open operating systems, eliminating the need for an external applications processor.
The BCM2091 radio frequency transceiver provides RF connectivity for BCM21553 HSUPA processor. It also delivers a transceiver architecture that provides designers with flexibility in PCB board design and reduces external RF engine component count by more than 40% that reduces bill-of-materials (BoM) cost, the company claims.
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