Westinghouse Electric Corp, Pittsburgh is taking out a marker for the emerging wafer-scale integration semiconductor technology by investing $5m in Inova Microelectronics Corp, Santa Clara, California. Privately-held Inova has developed a proprietary wafer-level interconnect architecture named Inroute, and that has encouraged Westinghouse to provide it with $2.5m in equity finance and $2.5m in lease guarantees, bringing Inova’s capitalisation to nearly $10m. The cash will go to speed development of ultra large scale monolithic chips for use in complex electronic systems for defence, space and commercial applications. Inova has so far produced evaluation quantities of three statics, the most recent interconnecting 128 static circuits across the surface of a full wafer, and wants to do more complex parts.
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