TDK Systems Ltd says that it will bring a single chip Bluetooth ‘radio’ component to market in six to nine months, ahead of a rival offering from Cambridge Silicon Radio (CI No 3,659), which expects to start volume production of its chips in 2000. The UK arm of TDK is working with an unnamed company to develop the chip for the shortwave radio interconnect standard championed by Nokia, Ericsson, IBM, Intel and others. Nick Hunn, TDK Systems Europe’s technical manager, said the production line for the new chips had been completed. A formal announcement will be made on June 11 at the Bluetooth Conference in London.
