Memory chip and modem maker Simple Technology Inc has filed a patent infringement suit against Dense-Pac Microsystems Inc, alleging infringement of STI’s chip-stacking technology. The claim, filed in US District Court in California, seeks unspecified damages as well as a permanent injunction against further Dense-Pac sales of products containing the disputed technology. There are currently 4 DRAM products listed in the complaint but STI asserts that it may add more products that illegally incorporate its design to that list soon. STI says the disputed 3-D memory design allows industry-standard packaged memory devices to be stacked together in the same footprint to act as a single device, enabling a system to reach higher capacity with its existing number of memory slots.
