Taiwan Semiconductor has unveiled iRCX, an interoperable electronic design automation (EDA) data format, for TSMC 65nm and 40nm technologies.
According to TSMC, iRCX format unifies interconnect modeling data delivery, ensures data integrity and interpretation. iRCX supports interconnect related EDA applications, including place & route, RC extraction, electromigration analysis, power integrity analysis and electromagnetic simulation. EDA tools which support iRCX format claim to receive accurate interconnect modeling data from the iRCX files.
iRCX claims to be the first of several interoperable EDA interface formats co-developed between TSMC and its design tool partners as part of the TSMC open innovation platform.
TSMC collaborates with EDA ecosystem partners in the iRCX initiative, defines unified format based on TSMC process requirements and works with EDA partners to implement the new format support in the tools.
Shauh-Teh Juang, senior director of design infrastructure marketing at TSMC, said: “iRCX is part of the TSMC Open Innovation Platform that includes the Active Accuracy Assurance Initiative. This new unified EDA data format provides designers the ability to select qualified EDA tools to match their design needs, improve compliance with TSMC processes and ensure design accuracy for first time silicon success.
