View all newsletters
Receive our newsletter - data, insights and analysis delivered to you
  1. Technology
  2. Software
December 14, 2010

Dialog Semiconductor unveils 2D to 3D video conversion chip for smartphones, tablets

Users will be able to view 3D content without the need for glasses

By CBR Staff Writer

Dialog Semiconductor, a provider of integrated display, audio and power management semiconductor offerings, has unveiled a real time 2D to 3D video conversion chip DA8223 for portable devices, including smartphones and tablet PCs.

The company said the device also integrates a parallax barrier screen driver that lets users view 3D content without the need for glasses.

The IC analyses each 2D video frame and creates a layered depth map, isolating foreground and background objects, and from this, each original image pixel is mapped into left and right eye pixels that, when viewed through a parallax barrier filter on the display module, renders the 3D image directly.

The DA8223 integrates the complete 3D conversion process, which means there is no extra load on the host application processor and no external memory requirement.

Dialog Semiconductor VP corporate development and strategy Mark Tyndall said using the DA8223 their customers can, without compromising battery life, create a truly unique offering; products with immediate access to unlimited 3D content.

Tyndall added, "The hardware based 2D-3D conversion technology requires virtually no software development and uses a tiny fraction of the battery and compute power of competing application processor based software-approaches."

Content from our partners
Why all businesses must democratise data analytics
How start-ups can take the next step towards scaling up
Unlocking the value of artificial intelligence and machine learning

Compatible with 3D capable displays from 3.8 inch smartphones up to 10 inch tablet PCs, the DA8223 supports still images and video at 60fps and able to display 3D content in both portrait and landscape formats in real-time.

The 5x5mm 81-ball UFBGA chip can be mounted on the PCB, between the application processor and 3D display, or on the display module as a chip-on-flex.

The company said that device samples will be available early in 2011, and expects mass production from the second half of 2011.

Websites in our network
NEWSLETTER Sign up Tick the boxes of the newsletters you would like to receive. Tech Monitor's research, insight and analysis examines the frontiers of digital transformation to help tech leaders navigate the future. Our Changelog newsletter delivers our best work to your inbox every week.
I consent to New Statesman Media Group collecting my details provided via this form in accordance with the Privacy Policy
SUBSCRIBED
THANK YOU