Ansys has unveiled a new version of Icepak software, which provides fluid dynamics technology for electronics thermal management.
The Icepak 12.0 reportedly introduces new applications for printed circuit board (PCB) and package thermal analysis, new and enhanced technology for meshing complex geometry, and new physical modelling capabilities.
According to Ansys, the new version enhances the product development process by simulating the dissipation of thermal energy in electronic devices at the component, board or system level. Based on its Fluent CFD solver, the new version has a user interface which enables users to create models of electronic assemblies.
The company said that the integration of its Iceboard and Icechip capabilities into the new version provides engineers with an integrated platform to analyse package, PCB and system designs. A new PCB trace Joule heating modelling capability along with the import of DC power distribution profiles from Ansoft SIwave software is expected to enhance the thermal simulation of PCBs.
The new version also offers fan modelling capabilities, parallel processing, post-processing and new libraries including heat sinks, thermo-electric coolers, materials and macros.
