SiS Corp is capitalizing on Intel Corp’s delay with its Camino 820 chipset by announcing the launch dates for its SiS630 rival offering and its plans to build a new fab plant. The chipset integrates the north bridge chip and south bridge chip and a 128-bit 3D graphics accelerator on one chip, according to SiS. The chip has soft modem, phoneline networking support, TV out and soft DVD capabilities.
SiS claims that the chipset will be produced in volume by August. Intel’s Camino is not expected to be widely available before the end of the year. The 630 supports the emerging PC133/266 memory specification – a window of opportunity for memory vendors backing the standard over the Intel-approved Rambus interconnect technology. SiS says that the SiS630 can save over $150 for board makers and shrink time to market.
The SiS630 supports Intel Pentium II and III and Celeron processor. SiS has also launched SiS540, which has a socket 7 connection for the AMD K6-III. A combination of five USB ports and four PCI slots can be built into motherboards using the chips. The SiS630 will cost $35 in 10,000 unit quantities, it is expected available in volume in August, the 540 will cost $29.
Separately, the company has announced its intention to raise $611m by the end of the year to build a new wafer fabrication plant According to Taiwan’s Commercial Times. It plans to do so via cash-capitalization programs, global depositary receipts and convertible bonds.
