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September 15, 1998

SHARP & MITSUBISHI PUSH STACKED CHIP STANDARD

By CBR Staff Writer

Mitsubishi Electric Corp and Sharp Corp are adopting a single specification for stacked chip-size packaging (CSP) and are pushing the spec as a new CSP standard. CSP technology allows for smaller integrated circuits by packaging together two different types of microchips. The Nihon Keizai Shimbun reports that the companies are initially working on a combined Flash memory and static random access memory (SRAM) stack using the CSP specification, for cellular phones and wireless data devices. Seiko Epson Corp is already reported to be backing the CSP spec as a new standard.

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