At least seven new semiconductor wafer fabrication plants and as many new chip assembly facilities will be constructed in the People’s Republic of China over the next five years, Wang Guoguang, deputy director of the Ministry of Electronics Industry, declared at the Semicon/China 95 exhibition and symposium in Shanghai last month. He added that the microelectronics industry road map outlined in China’s Ninth Five-Year Plan would create tremendous market demand for semiconductor equipment and materials. Among planned new fabs are at least three 0.5-micron 8 CMOS wafer fabs and two 0.8-micron 6 wafer lines. New assembly facilities include at least eight foreign investment projects totalling nearly $400m, and several new state-run plants. The Semicon/China 95 exhibition and symposium featured 125 exhibits, manufacturing standards meetings and technical programme.