Samsung Electronics has developed a multi-die package that measures a 0.6mm in height. The new memory package, designed initially for 32GB densities, is half the thickness of a conventional memory package of eight stacked chips.
The company claims that the advanced packaging technology delivers a 40% thinner and lighter memory for high-density multimedia handsets and other mobile devices. It also overcomes the conventional technology limits of a chip’s resistance to external pressure when under 30um in height.
The new 0.6mm-thick package, which consists of eight identical dies, uses 30-nanometer-class, 32GB NAND flash chips, each measuring 15um, to deliver a 32GB NAND product, the company said.
Samsung Electronics said that the 15um-thickness can allow double the density of previous multi-chip packages. The thinner die also reduces chip weight. In addition, the new package technology can be adapted to other existing MCPs, configured as system in packages (SiPs), or package on packages (PoPs).
Tae-Gyeong Chung, vice president of test and package center for package development team at Samsung Electronics, said: “We have achieved a major reduction in the thickness and weight of a large multi-die package to provide the best solution for combining higher density with multi-functionality in current mobile designs.”
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