Rambus Inc has now issued the specifications for Direct RDRAM memory technology suitable for mobile devices, including Rambus memory devices and SO-RIMM small outline memory modules and connectors, so that laptops can take advantage of the two-times memory bandwidth increase over current SDRAMs without using up too much space or taking up too much power. Mobile systems will support 16Mb to 384Mb using 128 megabit RDRAMs, with module upgrade plans for future 256 megabit and 512 megabit RDRAM densities. Up to three modules can be supported. Power consumption should be half the power of comparable SDRAM, depending on the workload. Toshiba America Electronic Components Inc and Kingston Technology Co have been working with Rambus on the RIMM and SO-RIMM memory modules for RDRAM, and delivered the first 160-pin module prototypes to Rambus for mobile systems, initially using 72 megabit RDRAMs. Smart Modular Technologies Inc also has sample modules available, and Molex Inc says it will have samples this quarter. Intel Corp charts show that it expects the take-up of Direct RDRAM in mobile systems to begin in the middle of next year.