According to Qualcomm, the chips will reduce the cost of WCDMA mobile broadband high-speed downlink packet access (HSDPA) and high-speed uplink packet access (HSUPA) handsets.
The msm6246 chipset will support 3.6Mbps HSDPA for services such as high-resolution video downloads and web 2.0 browsing. The msm6290 HSUPA chipset supports speeds up to 7.2Mbps on the downlink and 5.76Mbps on the uplink. The two products are compatible with each other with power management and software and RF compatibility. Both products interface with the RTR6285 single-chip CMOS transceiver.
With more than 140 mobile operators in 65 countries now offering commercial HSPA services, mobile broadband is quickly gaining economies of scale, said Alex Sinclair, chief technology officer at GSMA. We are pleased to see the mobile ecosystem making HSPA ever more affordable, enabling more and more people to enjoy high-speed access to multimedia services while on the move.
The proliferation of HSPA is helping drive the growth of popular internet and social networking applications in the mobile space, added Alex Katouzian, vice president of product management at Qualcomm CDMA Technologies.
In March 2006, Nortel and Qualcomm achieved what was thought to be the first 7.2Mbps HSDPA mobile data calls using test terminals based on Qualcomm’s MSM6280 solution and Nortel’s HSDPA network equipment. In July, Qualcomm had achieved 2.0Mbps for a HSUPA test call.
Source: ComputerWire daily updates
