View all newsletters
Receive our newsletter - data, insights and analysis delivered to you
  1. Technology
December 2, 1993

POWDERED DIAMOND AND COPPER DYMALLOY FOR HEAT DISSIPATION

By CBR Staff Writer

As competition in the microprocessor world (literally) hots up, Sun Microsystems Inc and the US Lawrence Livermore National Laboratory are releasing samples of a new substrate that conducts up to five times faster than conventional packaging materials. Dymalloy is a combination of powdered diamond and copper and is development of work carried out at Lawrence Livermore during the Strategic Defense Initiative’s Brilliant Pebbles project. In addition to its heat-dissipation abilities, Dymalloy has the same thermal expansion properties as silicon, which means that standard microprocessor chips can be mounted on a Dymalloy base, serving to cool them. The researchers say that they they can use the diamond dust commercially available as a by-product of industrial mining or the synthetic stuff. This costs about 50 cents a carat, through they do not say how much would be required for the average multi-chip module seen as the main market for the substance. Howard Davidson, physicist and engineer at Sun Microsystems Laboratories believes Dymalloy could find its way into commercial workstations within a couple of years, and into personal computers thereafter. At present the team is looking for a manufacturer for the material.

Websites in our network
NEWSLETTER Sign up Tick the boxes of the newsletters you would like to receive. Tech Monitor's research, insight and analysis examines the frontiers of digital transformation to help tech leaders navigate the future. Our Changelog newsletter delivers our best work to your inbox every week.
I consent to New Statesman Media Group collecting my details provided via this form in accordance with the Privacy Policy
SUBSCRIBED

THANK YOU