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February 19, 2009

Nokia selects Broadcom as next-generation 3G chipset supplier

The parties also co-operate on Nokia modem technology

By CBR Staff Writer

Nokia has selected Broadcom, a supplier of semiconductors for wired and wireless communications, as a next-generation 3G baseband, radio frequency and mixed signal chipset system supplier for worldwide markets.

According to Nokia, the two parties will co-operate on technology, including Nokia modem technology.

Scott McGregor, president and CEO of Broadcom, said: We are very pleased to have been selected by Nokia as a 3G HSPA supplier leveraging Broadcom’s strengths in mixed signal, multimedia and cellular platform technologies. We look forward to developing great products and continuing to build upon our existing relationship to help Nokia realize their mission of connecting people.

Kai Oistamo, executive vice president for devices at Nokia, said: Today’s announcement with Broadcom is a further example of Nokia’s commitment to our diversified, multi-supplier chipset strategy. This agreement, which targets low cost, high volume markets, demonstrates that we view Broadcom as a reliable supplier to bring the benefits of 3G to Nokia customers around the world.

Earlier in December 2008, Samsung electronics has selected Broadcom’s Blu-ray Chipset System to Power Blu-ray Products in Its 2009 Lineup.

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