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January 4, 2017

Qualcomm, Verizon IoT tie-up looks to cut time to market

The two partner to accelerate with the development of IoT innovation.

By Hannah Williams

Qualcomm is partnering with Verizon on a modular platform for the IoT, with the tie-up aimed at helping manufacturers accelerate time to market for IoT devices.

Announced at CES 2017, Qualcomm launched a ThingSpace-ready module from Quectel and Telit, which uses Qualcomm’s MDM9206 Category M1 (Cat-M1) LTE modem.

ThingSpace is Verizon’s web-based IoT development platform, billed as a simplified IoT workspace for developers to take ideas from prototype to market. Tying up Qualcomm’s MDM9206 LTE modem with its ThingSpace platform, Verizon will be releasing a development kit which is expected to hit the market in early 2017.

In addition, Verizon’s pre-integrated ThingSpace software provides a one-stop global solution for both wireless data and cloud service management for IoT devices. The combination of the LTE Cat-M1 capabilities of the MDM9206 modem with Verizon’s 4G LTE network and ThingSpace platform offers a simplified approach for building, deploying and managing IoT applications, which can be customized for a wide range of IoT use cases including asset management, industrial automation, wearables, smart cities and more.

“We’re pleased to work with both Qualcomm Technologies and Verizon to quickly commercialize a ThingSpace-ready LTE Cat-M1 module,” said Patrick Qian, chief executive officer, Quectel.

“This work will result in earlier opportunities for product OEMs to take advantage of Verizon’s Cat-M1 network rollout. We see great opportunities for new and creative IoT applications benefiting from the implementation of ThingSpace software and Qualcomm Technologies’ MDM9206 LTE modem technology in Quectel’s BG96 module enabling performance and cost optimized products.”

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