NEC Electronics and Toshiba have extended their technology development agreements with IBM to participate in the development of a 28-nanometer (nm), high-k metal gate (HKMG) chip technology.
According to the companies, the 28nm technology can contribute to faster processing speed and longer battery life in mobile communication devices and other consumer electronics applications.
The 28nm alliance builds on the earlier joint development work in 32nm HKMG technology. The companies claim that clients can transition to 28nm technology without the need for a significant redesign.
Toshiba and NEC Electronics joined IBM bulk semiconductor process technology development alliance in December 2007 and September 2008, respectively.
Masao Fukuma, senior vice president of NEC Electronics, said: The advanced 28nm low-power process technology will dramatically enhance the product’s density, performance, as well as power consumption compared to the former 40nm node, providing highly competitive solutions, especially in the fields of consumer electronics and automotive.
Currently, the IBM technology alliance includes Chartered Semiconductor Manufacturing, GLOBALFOUNDRIES, Infineon Technologies, NEC Electronics, Samsung Electronics, STMicroelectronics and Toshiba.
