Santa Barbara, California-based nChip Corp and Superconductor Technologies Inc will collaborate in the development of cryocooled multi-chip modules for the high speed computing, file server, telecommunications and test equipment markets, the companies have announced. Superconductor Technologies cooling system is currently used to cool high temperature superconductor cellular base station filters. The system is capable of cooling microelectronic components down to minus 173 degrees C. The cooler uses a gas bearing that eliminates wear by enabling the compressor’s piston to float on a cushion of Helium gas. Packaging the speed-critical components into an multi-chip module minimises the space that needs to be chilled and maximises the performance gains. nChip’s multi-chip module technology, which uses the same processes and materials as conventional silicon semiconductors, is already in volume production for applications like those expected to adopt cooled semiconductors. Because of the materials used, it can easily tolerate the temperature excursions that will be seen in a cooled system, say the companies.
