View all newsletters
Receive our newsletter - data, insights and analysis delivered to you
  1. Technology
November 29, 2009

MoSys launches 40nm DDR3, DDR3/2 combo PHYs

Claims to support datarates of up to 2133Mbps

By CBR Staff Writer

MoSys, a supplier of embedded memory and high-datarate parallel and serial interface IP, has launched DDR3 and DDR3/2 combo PHYs.

The company claims that its fully integrated offering complies with the new DFI specification and provides the physical layer (PHY) interface between the controller logic and DDR3/2 DRAM devices.

The DDR3/2 PHYs can achieve datarates up to 1600Mbps in a wirebond package and 2133Mbps in flip chip packaging, making them suitable for high performance and cost sensitive designs.

MoSys’ DFI 2.1 compliant DDR 3/2 PHY product is available to chip designers using 40nm and 65nm processes, and its DDR 3/2 Combo PHY device is available in both wirebond and flipchip configurations. Offering a choice of 1.8V or 2.5V IO FETs, the DDR PHYs support datarates up to 2133Mbps, the company said.

Content from our partners
Sherif Tawfik: The Middle East and Africa are ready to lead on the climate
What to look for in a modern ERP system
How tech leaders can keep energy costs down and meet efficiency goals

David DeMaria, vice president of business operations at MoSys, said: “DDR3 is rapidly gaining adoption as the next generation of the DDR memory interface. The availability of our DDR3/2 Combo PHY and its seamless interoperability with Denali’s memory controller ensures speedy time-to-market for our customers’ chip designs.

David Lin, vice president of marketing at Denali Software, said: “Our high-performance memory controllers and predictable protocol verification portfolio are the industry’s most widely used, silicon-proven solutions. MoSys’ DDR3/2 Combo PHY extends our ability to provide best-in-class, end-to-end memory interconnect solutions to our mutual customers.”

Topics in this article :
Websites in our network
Select and enter your corporate email address Tech Monitor's research, insight and analysis examines the frontiers of digital transformation to help tech leaders navigate the future. Our Changelog newsletter delivers our best work to your inbox every week.
  • CIO
  • CTO
  • CISO
  • CSO
  • CFO
  • CDO
  • CEO
  • Architect Founder
  • MD
  • Director
  • Manager
  • Other
Visit our privacy policy for more information about our services, how New Statesman Media Group may use, process and share your personal data, including information on your rights in respect of your personal data and how you can unsubscribe from future marketing communications. Our services are intended for corporate subscribers and you warrant that the email address submitted is your corporate email address.
THANK YOU