LSI Corp, the system-on-a-chip company, has licensed its organic laminate flip chip packaging technology to Amkor Technology Inc. Ian Jackson, ASIC marketing manager, said the packaging technology increased the performance of the chip because of improvements in electrical and heat efficiency over traditional ceramic flip chip packages. In addition, the organic packaging also allows for a larger package than traditional materials. System on a chip components – which LSI defines as a microprocessor or digital signal processor with memory and a logic core combined in a flip chip package – made using the organic packaging are intended for very high end use. LSI sees the chips being used in high performance servers and workstations and large public telecoms switching systems. Amkor, the world’s largest contract chip assembler, is working with third parties on flip chips using the organic packing. The first fruits of the deal are expected to be seen in a year to 18 months. Financial terms of the deal were not disclosed.
