Lattice Semiconductor has announced the availability of automotive temperature qualified (AEC-Q100) Chip Scale 132 BGA (ball grid array) packaging for the non-volatile LatticeXP2 FPGA family.
According to Lattice, the new XP2 family’s new Chip Scale packaging based on its 90 nanometre hybrid flexiFLASH technology will enable realisation of design requirements in the form-factor automotive applications such as automotive camera modules, telematics systems, parking assistance systems and multimedia systems.
The new Chip Scale 132 BGA packaging reportedly meets AEC-Q100 requirements from the Automotive Electronics Council (AEC), and is available for the XP2-5 and XP2-8 devices, with five thousand and eight thousand LUTs (Look Up Tables), respectively.
The company claims its package footprint, measuring 64 mm2 and 1.35 mm in height, to be the smallest available for non-volatile FPGA.
Sean Riley, vice president and general manager of high density solutions at Lattice, said: Our non-volatile XP2 family in AEC-Q100-qualified, low-cost Chip Scale 132 BGA packaging is a compelling solution for automotive designers who value high integration, source synchronous interfaces and low power consumption for tight form-factor applications.
“This single chip solution delivers the most FPGA value in the smallest footprint available, an important requirement for most automotive systems, including cameras, engine control modules and media centres.
