According to KLA-Tencor, the WaferSight 2 combines flatness and nanotopography in a single system and allows shorter cycle times, reduced WIP queuing and move times and smaller footprint compared to multiple tool solutions. It can also be combined with its FabVision, allowing offline analysis of archived or current metrology data with customized charts and reports.
The company claims that it is also the first solution to measure both frontside and backside nanotopography in a single, non-destructive measurement.
KLA-Tencor said that nanotopography control has become critical at the 45nm node because it is a cause of reduced process margin in common midpoint and can cause CD variation in lithography. It is estimated that slight variations in wafer flatness can consume 50% of the critical lithography depth of focus budget at 45nm.
Jeff Donnelly, vice president of growth and emerging markets at KLA-Tencor said: At 45nm and beyond, variations in wafer flatness, shape and surface topography can have a more severe impact on process windows and yield for lithography and other manufacturing processes.
The company also launched the Aleris 8500, which it claims to be the first system to combine production-worthy composition and multi-layer film thickness metrology.
In October 2006, KLA-Tencor launched the VisEdge CV300 edge-inspection system, which is thought to be the first inspection solution capable of wafer-edge inspection in the production environment and helped reduce a yield loss of 10-50%.
Source: ComputerWire daily updates
