Capital Semiconductor and InterDigital have entered into a strategic relationship for 3G technology transfer and a mutually beneficial licensing agreement, whereby InterDigital will deliver its SlimChip modem core for integration into CapiSemi chips for 3G mobile devices.
The company said that the SlimChip modem core features 3G modem technology with HSPA compliant with the UMTS 3GPP Release 6 standard.
InterDigital will also provide comprehensive engineering support for the efficient integration of the SlimChip modem core into CapiSemi products for the 3G cellular market and both the companies have agreed upon a licensing agreement that will support mutual success in the 3G market.
Shugang Li, president of CapiSemi, said: CapiSemi will be closely working with InterDigital to develop our 3G and 4G Baseband chip products and wireless module solutions. CapiSemi will first use the proven 3G SlimChip Modem technology from InterDigital in our first generation of HSPA Baseband chip products.
