The product, codenamed Tanggula, is being launched as the next phase of Intel’s Mobile Initiative for Learning in Education, a scheme intended to accelerate the adoption of mobile computing and wireless technologies in Asian universities.
The company is claiming the new notebook platform will include enhanced security, wireless capability and high quality sound and audio for multi-media enabled interactive learning and entertainment. The system will also have specific features for students, which are expected to be disclosed closer to its introduction. Initial OEM systems based on the Tanggula platform are expected to be available in the second half of this year.
In addition, the Tanggula will comply with the Common Building Block program, an initiative set up to define common notebook ingredients based on pre-existing industry specifications.
Intel’s mobile computing technology has the power to completely reinvent how people teach, research and study, especially at a university level where collaboration and flexibility are so important, said David Perlmutter, vice president of mobility group, Intel.
Other technology companies participating in the Mobile Initiative for Learning in Education include HP, IBM, Lenovo and Ocamar Technologies.
