View all newsletters
Receive our newsletter - data, insights and analysis delivered to you
  1. Technology
July 8, 1990

INTEL ADDS EMBEDDED VERSION OF 80186, COMPACT SURFACE MOUNT FLASH MEMORY

By CBR Staff Writer

Intel Corp has introduced a 16-bit 80C186EB embedded processor based on a new modular static design. It is code-compatible with the 8086 and 80186, and there is also an 8-bit external bus version with 16-bit internal operation. Standard features include a 10 channel chip set, refresh control unit, programmable timer and interrupt control, two multiplexed input output ports and two-channel serial communications. Also included is an 80C187 numeric co-processor interface, and system level testing. Both the 80C186EB and 8-bit external version, the 80C188EB, come in an 84-lead plastic chip carrier and 80-lead quad flat package. They will be shipping in volume during September. Intel has also introduced a new flash memory package available in 1M-bit and 2M-bit densities. It says that the 28F010 and F8F020 devices are targeted at applications requiring small form factor combined with high density. The TSOP design thin, small outline package – measures 0.8 by 0.3 by 0.05 and is said to be between 33% to 50% the volume of other surface mount packages. The company believes that the new packages are most appropriate for memory cards, handheld instruments, laptop and notebook computers, disk drives, and portable communication devices. The 28F020 has a maximum read access speed of 150nS with a byte write time of 10 microseconds. It is available in three packages – the 32-pin TSOP, a 32-leaded plastic chip carrier, and a 32-pin plastic dual-in-line package. The 28F020 TSOP is UKP32 in quantities of 10,000, the other versions are both UKP25 also in quantities of 10,000. The 1M-bit 28F010 costs UKP13 in the same quantities.

Websites in our network
Select and enter your corporate email address Tech Monitor's research, insight and analysis examines the frontiers of digital transformation to help tech leaders navigate the future. Our Changelog newsletter delivers our best work to your inbox every week.
  • CIO
  • CTO
  • CISO
  • CSO
  • CFO
  • CDO
  • CEO
  • Architect Founder
  • MD
  • Director
  • Manager
  • Other
Visit our privacy Policy for more information about our services, how New Statesman Media Group may use, process and share your personal data, including information on your rights in respect of your personal data and how you can unsubscribe from future marketing communications.
THANK YOU