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March 3, 2015

Intel woos mobile market in Barcelona

System on Chip for mobiles announced by CEO at MWC.

By Alexander Sword

Intel has launched new mobile platforms, including a low-cost system-on-chip (SoC) for mobile devices, a global LTE solution, a PC offering and customers for mobile device and network offerings.

The announcements by CEO Brian Krzanich included the Intel Atom x3 processor series, Intel’s first integrated communications platform for low-cost tablets, phablets and smartphones. The SoC combines the applications processor, image sensor processor, graphics, audio, connectivity and power management components into one chipset.

Also announced in the SoC range were Intel’s first 13nm Atom SoC and the Intel Atom x5 and x7 processor series. The latter are targeted at high-end devices.

In addition, Intel announced its XMM 7360, an LTE Advanced Category 10 modem. This supports 3x carrier aggregation and download speeds up to 450 Mbps.

Intel also tackled the 5G market with a pre-5G concept system, combining LTE with 802.11ad to provide data speeds of above 1 Gbps.

New customers were announced for Intel’s True Key technology, including Brightstar Corp., Deutsche Telekom and Prestigio. Companies including ASUS and Jolla have committed to using Intel Atom x3 designs, and collaborations with LG and Samsung will see Intel’s security features on handsets.

"The evolution of the mobile landscape and growth of smart, connected devices has led to increased demand for more connectivity and real-time, protected data on those devices," said Krzanich.

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He added: "All of these factors are driving a transformation of the network to accelerate the delivery of new personal computing experiences, services and capabilities in a safe and secure manner. Intel is one of the only companies in the world that can provide solutions end-to-end for the full spectrum of mobility."


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