US based chipmaker Intel is working on a new chip manufacturing technology, the Tri-Gate 3D chip technology, to develop 22nm systems-on-a-chips (SoC) for smartphones and tablets to compete with ARM architecture in the rapidly-growing mobile market.
Intel said in a statement: "Intel’s 22 nm SoC technology will be ready for high volume manufacturing in 2013."
Currently, Intel’s mobile SoCs measure 32nm, while rival Qualcomm develops its high-end SoCs at 28nm and Nvidia deploys 40nm technology.
According to the firm, the new production processes will mainly minimise the size of circuit within the chips that incorporate microprocessors with several other components and will cut the cost of offering new functionalities, while offering enhanced performance and power efficiency.
In 2011, the chipmaker introduced three-dimensional transistor structures (the TriGate-based technology) into its chips, which is a sharp exit from earlier designs to advance computing speed while reducing power consumption.
Intel also said that the new SoC method can develop transistors that are 22% to 65% faster compared to 32nm versions, while offering a new standard to manage current leakage and provide several component choices for chip designers.
The chipmaker has already started offering SoCs under the Atom brand that have been selected for several smartphones.