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Technology / AI and automation

Intel extends chip manufacturing deal with Altera

Intel is developing multi-die devices with Altera, building on its earlier chip manufacturer deal to build Altera’s Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process.

The latest deal blends separate components such as processors, memory and programmable chips into customised devices using a method that brings down manufacturing costs, while boosting performance.

Intel Custom Foundry VP and general manager Sunit Rikhi said that the company’s partnership with Altera to manufacture next-generation FPGAs and SoCs using 14 nm Tri-Gate process is going well.

"Our close collaboration enables us to work together in many areas related to semiconductor manufacturing and packaging," Rikhi said.

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"Together, both companies are building off one another’s expertise with the primary focus on building industry-disrupting products."

The collaboration is expected to help Altera boost the performance of processors for communications, high-performance computing and military applications.

Multi-die packaging is targeted at efficiently linking separately made parts into a single system-in-a-package solution.

Altera research and development SVP Brad Howe said that the collaboration on heterogeneous multi-die device development reflects a shared commitment by both companies to improve the bandwidth and performance of next-generation systems.

"Leveraging Intel’s advanced manufacturing and chip packaging capabilities will allow Altera to deliver system-in-a-package solutions that have been identified as critical to meeting overall performance requirements," Howe said.
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CBR Staff Writer

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