"Together, both companies are building off one another’s expertise with the primary focus on building industry-disrupting products."
The collaboration is expected to help Altera boost the performance of processors for communications, high-performance computing and military applications.
Multi-die packaging is targeted at efficiently linking separately made parts into a single system-in-a-package solution.
Altera research and development SVP Brad Howe said that the collaboration on heterogeneous multi-die device development reflects a shared commitment by both companies to improve the bandwidth and performance of next-generation systems.
"Leveraging Intel’s advanced manufacturing and chip packaging capabilities will allow Altera to deliver system-in-a-package solutions that have been identified as critical to meeting overall performance requirements," Howe said.
This article is from the CBROnline archive: some formatting and images may not be present.
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