Intel is developing multi-die devices with Altera, building on its earlier chip manufacturer deal to build Altera’s Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process.
The latest deal blends separate components such as processors, memory and programmable chips into customised devices using a method that brings down manufacturing costs, while boosting performance.
Intel Custom Foundry VP and general manager Sunit Rikhi said that the company’s partnership with Altera to manufacture next-generation FPGAs and SoCs using 14 nm Tri-Gate process is going well.
"Our close collaboration enables us to work together in many areas related to semiconductor manufacturing and packaging," Rikhi said.
"Together, both companies are building off one another’s expertise with the primary focus on building industry-disrupting products."
The collaboration is expected to help Altera boost the performance of processors for communications, high-performance computing and military applications.
Multi-die packaging is targeted at efficiently linking separately made parts into a single system-in-a-package solution.
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Altera research and development SVP Brad Howe said that the collaboration on heterogeneous multi-die device development reflects a shared commitment by both companies to improve the bandwidth and performance of next-generation systems.
"Leveraging Intel’s advanced manufacturing and chip packaging capabilities will allow Altera to deliver system-in-a-package solutions that have been identified as critical to meeting overall performance requirements," Howe said.
