The companies will also set-up a 50:50 joint venture to produce DRAM chips and will build a joint manufacturing facility in Taiwan to exploit the technology they develop. The companies said that when up and running, the 300mm facility will have capacity for 50,000 wafer starts a month. The companies will also transfer their 0.09 micron technology to 200mm wafers. The deal is just the latest example of DRAM players pooling their efforts to enable them to stay in the cut-throat memory market.
Source: Computerwire
