According to Imbera, the embedded packaging technology will enable Ibiden to offer its clients a cost effective miniaturization solution with the versatility to support a wide range of product applications. Ibiden expects to use Imbera’s integrated module board (IMB) technology in a series of projects going forward.
Imbera has claimed that its technology will allow original equipment manufacturers and original design manufacturers to produce smaller boards, in a cost-effective manner by making simple adaptations to existing manufacturing processes.
Unlike traditional surface mount technology, IMB technology embeds components inside an organic substrate. Using the technology it is possible to embed all kinds of components including discrete passive components, application specific integrated passive components, bare dies and wafer level chip scale packaging, said Imbera Electronics.
Imbera has said that its manufacturing process combines printed circuit boards (PCB) manufacturing, component packaging and component assembly into a single manufacturing sequence. The benefit of this shortened process means less materials and equipment are needed, logistics are simplified and less labor is required.
Due to its novel and advanced manufacturing process, IMB technology can be used to embed components inside a module substrate and manufacture a typical multi-chip-module and system-in-package product. Alternatively, IMB technology can also be used to embed the components inside a motherboard to manufacture a system-in-board product. The technology can be utilized in various applications from simple products with only a few components to demanding products, such as mobile phones and other portable products requiring high packaging density as well as good electrical and thermal performance.
Jeff Baloun, CEO of Imbera, said: This deal will help us to achieve significant recognition in the industry and enable others to see IMB’s great potential to satisfy the electronics market’s requirement for thinner, smaller products with enhanced electrical performance and functionality.
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