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October 13, 1998

IBM’S ADVANCES SIGE ON TWO WIRELESS FRONTS

By CBR Staff Writer

IBM Corp says it has started to ship chips for wireless devices built using the Silicon Germanium (SiGe) process and to its Commquest acquisition’s designs to select customers. For the most part they want fully-integrated multi-chip boards that can be quickly integrated into wireless devices. The boards will be available as both bespoke and generic designs. IBM’s other SiGe partners including Hughes Electronics want discrete components they can assemble into their own solutions. Having already built demonstration parts IBM’s now ramped a volume SiGe process in order to convince these companies it can mass produce the same parts.

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