The emerging agreement that Motorola Inc will co-develop and fabricate some future versions of IBM Corp’s Rios RISC is by no means the first major alliance between the two companies – one of the most important covers collaboration on IBM’s sychrotron-generated X-ray lithography project. The two companies have now teamed up on a third with IBM licensing Motorola to use its patented C4 flip chip and Direct Chip Attach processes to package integrated circuits. With the flip chip, IBM lays the chip on its back where it makes direct contact with solder bumps on a substrate or onto the surface of the board when used with the Direct Chip Attach.
