View all newsletters
Receive our newsletter - data, insights and analysis delivered to you
  1. Technology
February 19, 1989

IBM GETS LOWER THAN EXPECTED YIELDS ON SOME THERMAL CONDUCTION MODULES

By CBR Staff Writer

No-one is panicking yet and there is no sign of serious delays, but IBM is understood to be getting lower than expected yields on some of the Thermal Conduction Modules for the 3090S models, and the snags are causing some upgrades from Es at some customer sites to be delayed by as much as a month or two: the problem is not at present being seen as serious to IBM’s bottom line and hasn’t shown up yet in the share price, although there was a knee-jerk drop on AIX being late.

Websites in our network
Select and enter your corporate email address Tech Monitor's research, insight and analysis examines the frontiers of digital transformation to help tech leaders navigate the future. Our Changelog newsletter delivers our best work to your inbox every week.
  • CIO
  • CTO
  • CISO
  • CSO
  • CFO
  • CDO
  • CEO
  • Architect Founder
  • MD
  • Director
  • Manager
  • Other
Visit our privacy policy for more information about our services, how New Statesman Media Group may use, process and share your personal data, including information on your rights in respect of your personal data and how you can unsubscribe from future marketing communications. Our services are intended for corporate subscribers and you warrant that the email address submitted is your corporate email address.
THANK YOU