IBM Corp and Siemens AG’s Information and Communication Networks division are to collaborate on next-generation system-on-a-chip products, the two announced yesterday. They will be built using IBM’s silicon germanium process technology, and will be used for mobile networked communication systems. As part of the deal, Siemens will gain access to IBM’s SiGe technologies currently under development. Standard silicon augmented with germanium can produce faster chips using less power. IBM introduced the first standard high-volume SiGe chips in October last year, and says it’s already been used for the RF components in devices such as cellular handsets and transmitter and receiver chips used in high-speed fibre optic phone lines.
