Under the deal Hynix has licensed DRAM stack process technology to ProMOS. At the same time, ProMOS will provide Hynix with access to its 300mm fab capacity. The companies will also collaborate on next-generation process technologies.
ProMos had previously signed a similar deal with Japan’s Elpida. Yesterday, the Taiwanese firm said that deal had been put on hold because of differing objectives.
This article is based on material originally produced by ComputerWire.
