Huawei has announced a franchise agreement allowing SILICA to distribute 3G and 4G wireless modules based on Huawei’s HiSilicon chipset technology.
The wireless modules will be offered in a choice of popular form factors and offer M2M communication-specific features.
SILICA, an Avnet company, will provide in-depth technical and software support for the Huawei modules, which will be employed on their ArchiTech evaluation boards. These boards will also feature mini PCIe connections and SIM card-holders.
The technology taps into the requirements of M2M communication and Internet of Things (IoT) applications, which demand low power and reliable wireless links.
"We are very glad to have found an experienced franchise partner with SILICA that will enable us to significantly leverage the marketing of our products," said Georg Steimel, Head of M2M Solutions, Huawei. "Its outstanding expertise in the industry and in-depth support make SILICA an ideal partner.
Steimel added: "The partnership with the agile and market leading player will accelerate our growth significantly and in combination with our innovative technology will help to gain the leadership in this market."
Mario Orlandi, president of SILICA, commented: "SILICA is delighted to have reached this agreement with the world’s leading cellular communications company.
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"The rate of innovation at Huawei is exceptional and will ensure that we’re able to provide our customers with leading-edge products in terms of performance, cost-effectiveness and reliability.
"M2M and the general IoT market is the fastest growing sector of the electronics industry and Huawei products make it easier than ever for customers to connect their products to the cloud."
