Hewlett-Packard Co has reorganized its semiconductor testing business to concentrate on selling system-on-a-chip (SOC) test equipment. The new Silicon-Systems Test Division is made up of the Boeblingen LSI Semiconductor Test Division, based in Germany, and the Japanese Hachioji mixed signal Semiconductor Test Division.
Bob Durstenfeld, a spokesperson for HP, said that the company would be releasing a new SOC test platform on July 15 which, unlike other test beds, would be able to encompass the entire SOC test procedure. Durstenfeld envisages the platform being widely used in the consumer electronics space to test systems for cell phones, set-top boxes and information appliances. The unit will also test RF chips and high-speed memory chips.
