Globalfoundries, a provider of semiconductor manufacturing technology, and Qualcomm have entered into a non-binding memorandum of understanding to collaborate on foundry technologies.
Initially, Globalfoundries intends to provide Qualcomm with access to 45nm and 28nm technologies with an intended collaboration on future advanced process nodes.
The relationship between the companies will focus on Qualcomm’s wireless businesses and provide technologies for handheld products that operate on the CDMA2000, WCDMA and 4G/LTE cellular standards including the smartbook device segment. Both companies anticipate that Globalfoundries will begin accepting Qualcomm designs at Fab 1 in Dresden in 2010.
In addition to technology nodes, the two companies intend to explore other areas to collaborate on technologies such as die-package interaction and 3D packaging.
Qualcomm’s Integrated Fabless Manufacturing (IFM) model employs a multi-foundry approach for ensuring product supply to Qualcomm’s device manufacturing customers.
Douglas Grose, chief executive officer of Globalfoundries, said: “By bringing the benefits of a leading-edge IDM model to the foundry world, we provide customers with the fastest option to get advanced products to market in volume and at mature yield. We’re pleased to have an opportunity to collaborate with a market leader like Qualcomm as they enable new classes of wireless products and technologies for the future.”
