GlobalFoundries and ARM have unveiled the details of their new system-on-chip platform technology for wireless products and applications.
The platform includes collaboration on two GlobalFoundries process variants, 28nm super low power (SLP) for mobile and consumer applications and 28nm high performance (HP) for applications requiring high performance.
The companies expect that the new chip manufacturing platform to enable a 40% increase in computing performance, a 30% decrease in power consumption and a 100% increase in standby battery life.
The combined SoC platform is based on the Cortex- A9 processor, physical IP and 28nm High-K Metal Gate (HKMG) process. It provides performance gains over the previous generation 40/45nm technologies.
Content from our partners
ARM also established strategic relationships with other members of the IBM Joint Development Alliance to enable the development of optimised processor and physical IP tuned to the HKMG process.
Tudor Brown, president of ARM, said: “Our collaboration with Globalfoundries will enable customers to rapidly bring high-performance, low-power ARM technology-based designs to market on a 28nm HKMG technology that is ready for high-volume implementation. The combination of Globalfoundries technology, our leading physical IP solutions, and the full internet capabilities delivered by ARM processors results in a powerful integration of processing, graphics and power efficiency.”
