This purchase order underscores the ongoing partnership between the two companies to develop an advanced laser singulation solution. The Cignis system enables full-wafer dicing of low-K dielectrics and copper interconnects. The goal of this effort is to produce a flexible, scalable laser solution capable of addressing multiple applications, such as wafer dicing, scribing and CMOS image sensor singulation.
Nick Konidaris, president and CEO of ESI, said: We greatly value this partnership with STMicroelectronics, and it is a prime example of ESI’s strong customer relationships serving as the catalyst for our success. As the photonic systems leader, we are well positioned to develop the picosecond laser system that enables the strategic competitive advantages ST requires to meet its aggressive manufacturing goals.
