Nineteen new chips will be introduced at the Embedded Processor Forum in San Jose, early in May, according to organizers MicroDesign Resources Inc. Intel Corp will disclose the next generation StrongARM, IBM Corp and Motorola Inc will announce embedded Book E enhancements to the PowerPC, and Hitachi Ltd promises a SuperH part claimed to exceed 1,000 MIPS/Watt.
ARM Ltd promises details of its new digital signal processing extensions to its core, and Texas Instruments Inc will reveal a new DSP with very low power consumption. Israeli company the DSP Group will also have the details of its third generation Teak DSP core. The show begins on May 3rd.
