Elpida Memory, Powertech Technology (PTI) and United Microelectronics (UMC) have entered into a 3-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm.
The collaboration will leverage the strengths of Elpida’s DRAM, PTI’s assembly, and UMC’s foundry logic technologies to develop a total 3D IC Logic+DRAM integration offerings.
The companies claim that the integration of DRAM and Logic technologies using TSV technology are expected to deliver the performance required for the ongoing convergence of communication, consumer and computing (3C) applications with mobile and handheld electronics.
The collaboration will facilitate the development of total offerings that includes Logic+DRAM interface design, TSV formation, wafer thinning, testing and chip stacking assembly for customers. The resulting technology is expected to increase cost competitiveness, improve logic yield impact, and accelerate entry into the 3D IC market, the companies said.
Iwata, senior vice president and R&D CTO of PTI , said: "This 3D IC integration with TSV technology can completely match PTI’s business and technology strategy. PTI has been providing advanced memory package and testing services to global 1st tier memory companies by using wafers as thin as 50um and superb die attach technology which enables 8Die to be stacked in one package in commercial base for smart phone applications.
"PTI has also been developing a stacked package with 16Die or more to maintain a low package profile. Meanwhile, PTI has been developing SiP for Logic customers since 2007, which we equip with WLCSP, Flip Chip and Passive components by wire bonding and SMT technologies such as System In Module for mobile handheld devices. PTI commits to this collaboration with Elpida and UMC in order to realise high performance from 3D IC integrated devices that are cost effective and contribute to the evolution of the semiconductor industry."
