Viking Modular Solutions, a division of Sanmina-SCI Corporation and manufacturer of DRAM modules and Solid State Drive (SSD) offerings, has launched its DDR3 8GB Very Low Profile (VLP) DIMM.
The new DDR3 8GB VLP RDIMM uses mainstream 2Gbit DDR3 DRAM to deliver a high-density offering for blade servers, storage bridge bay (SBB), AdvancedTCA and multiple space constrained high performance computing environments.
Built with Viking Modular’s BGA technology, the DDR3 8GB VLP RDIMM features Superior Thermal Performance, PC3-6400 to PC3-10600, DDR3-1333 240-pin VLP Registered DIMM, JEDEC Standard MO-269, thermal sensing energy management, low voltage option, and meets SWaP military COTS requirements.
The new high-density VLP RDIMM is designed for for original equipment manufacturer (OEM) users in the telecommunications, enterprise, cloud and embedded computing markets that need the benefit of high density in a very low profile form factor.
Viking Modular Solutions vice president of marketing Adrian Proctor said the new DDR3 8GB VLP RDIMM enables their OEM users in the enterprise server, storage and embedded markets the flexibility to upgrade new or existing platforms to maximum memory capacities.
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