Toshiba has launched a 64GB embedded NAND flash memory module, which it claims to be the highest capacity yet achieved in the industry.
The company said that new chip is a flagship device in a line-up of the six new embedded NAND flash memory modules that provide full compliance with new e-MMC standard and are designed for application in digital consumer products, including smartphones, mobile phones, netbooks and digital video cameras.
Toshiba claims that the new 64GB embedded device combines sixteen pieces of 32Gbit NAND chips fabricated with its 32nm process technology and the company has applied advanced chip thinning and layering technologies to realise individual chips that are 30 micrometers thick.
According to Toshiba, the new product line-up of NAND flash memory modules handle essential functions, including writing block management, error correction and driver software and simplifies system development, and supports capacities from 2GB to 64GB.
In addition, the new product line-up features support partitioning and security of e-MMC V4.4. Multiple storage areas can be configured, including memory areas for system files or code and a multi-level cell (MLC) area for data storage.
Scott Beekman, business development manager of mobile communications memory at TAEC, said: The e-MMC interface has become the most widely embraced embedded NAND solution with a built-in controller to simplify integration into system designs. With the addition of higher density, Ver 4.4 e-MMC compliant product offered as single package solutions or as part of a multi-chip module combined with DRAM, Toshiba can help designers reduce memory subsystem space requirements.”
The new 64GB product comes in a small FBGA package and has a signal layout compliant with JEDEC/MMCA V4.4. Mass production of the 64GB module is expected to start in the first quarter of 2010.
