Synopsys has rolled out new SuperSpeed USB 3.0 transaction-level models (TLM) supporting the Open SystemC Initiative (OSCI) TLM-2.0 API specification. The models are TLM representations of the Synopsys DesignWare SuperSpeed USB 3.0 Device and xHCI Host Controller IP.
The company said that the SuperSpeed USB 3.0 models enable pre-RTL and pre-silicon software development, verification and architecture exploration, as part of the DesignWare System-Level Library which features more than 100 TLM models including models of the DesignWare Interface IP portfolio.
The SuperSpeed USB 3.0 TLM models, which are cross-verified with the DesignWare SuperSpeed USB 3.0 Interface IP and the associated Linux drivers, enables development of virtual platforms for designs integrating the SuperSpeed USB 3.0 Interface, the company claims.
According to Synopsys, the new SuperSpeed USB 3.0 TLM models work in any IEEE1666-compliant SystemC simulator including the company’s innovator for virtual platforms and VCS for functional verification.
The DesignWare System-Level Library is part of Synopsys’ Software-to-Silicon Verification Solution that offers a suite of embedded software development, system validation, functional verification and circuit simulation software, hardware, intellectual property (IP), methodologies and services for system-on-chip (SoC) development.
The offerings includes the Confirma prototyping products, the VCS high-performance simulator, DesignWare IP, DesignWare System-Level Library and Innovator, enabling hybrid virtual/physical prototyping environment for embedded software development and verification.
Terry Moore, CEO of MCCI, said: The Synopsys USB virtual platforms developed with Innovator and DesignWare System-Level Library have proven themselves invaluable to MCCI and to our customers many times over. Our USB stack is ported and available for the customer’s platform much earlier in their product development than without using virtual platforms. This saves us and our customers critical time.
