SanDisk has introduced new iNAND Embedded Flash Drives (EFD), which are based on 3-bit-per-cell (X3) NAND flash technology and with support for e.MMC 4.4 specification.
The company said that the new devices, which are specifically designed for smartphones, offer up to 64 gigabytes (GB) of capacity in a single device, and can be used for boot, system code and mass storage functions.
According to SanDisk, the new 64GB iNAND EFD is based on an eight flash die stack design using its X3 32nm flash, and is offered in a 16x20x1.4mm form factor with a ball grid array (BGA) for quick integration into smartphone designs.
The iNAND EFDs consolidate system code and user storage into a single embedded device in order to conserve board space, simplify smartphone design and reduce power consumption, the company claims.
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Oded Sagee, director of mobile product marketing at SanDisk, said: The maturity of SanDisk’s X3 flash technology together with innovations in flash management are what allow us to continue making higher embedded storage capacities, such as 64GB, a practical solution in the market.
We understand the highly competitive environment in which our customers operate. By leveraging the substantial experience gained with our X3 NAND and significant advancements made in flash management technology, we offer our customers a very high return on their investment.
iNAND devices based on X3 technology fully comply with the e.MMC 4.4 specification and range in capacities from 4GB to 64GB.
