IBM has introduced a new chip-making technology that can be used to create advanced semiconductors to keep pace with the increasing number of Internet-connected devices and the data they are generating.
The company said that the Cu-32 custom logic offering employs its technology to increase the memory capacity and processing speeds of chips used in fibre-optic and wireless networks, routers and switches.
IBM said using Cu-32 in systems results in cellular infrastructure that can move one year’s worth of text messages (six trillion, worldwide in 2010) in less than ten seconds; a consumer downloading a feature-length film on a smart phone in less than ten seconds; or a HD version in under a minute; and routers that can stream every motion picture ever produced in less than one minute.
In addition, the embedded DRAM technology provides the dense on-chip dynamic memory that enables more than 1GB of memory on a single chip.
The company said the eDRAM performance has advanced to a point where it can replace conventional on-chip static memory (SRAM) in many applications, taking up 60% less space on the chip, and consuming up to 90% less power.
A suite of new high-sped serial cores (HSS) give Cu-32 advanced capabilities to network with more than a dozen different interface standards.
Further, the new Cu-32 offers a set of HSS cores in 32nm SOI technology including: 15G Backplane core supporting 16G Fibre Channel standard; 6G standards core supporting PCI-Express Gen1 & Gen2 standards; and PCI-Express Gen3 core supporting PCI-Express Gen1, Gen2, and Gen3 standards.
The company said that its eDRAM technology in a custom-logic design system provides flexibility that enables silicon offerings with memory optimised for an array of applications from servers and networking applications to game processors.
The eDRAM offering provides up to 600 MHz of random cycle performance while using up to ten times less standby power than conventional SRAM.