Elpida Memory and Spansion have extended their partnership agreement for joint development of NAND process technology and products to include a foundry services agreement for NAND Flash memory.
Through this extended alliance, the companies intend to identify additional areas of cooperation such as NOR Flash memory products and manufacturing. Elpida will produce the new NAND products at its 300mm Hiroshima wafer fab.
Yukio Sakamoto, president and chief executive officer of Elpida, said: "The alliance with Spansion and the licensing of Spansion NAND IP enable Elpida to develop advanced NAND products which, when combined with our leading DRAM products, allows us to better service markets including cellular handsets and digital consumer.
"Spansion has developed a very flexible, scalable Flash technology with its MirrorBit charge-trapping technology. We’re excited about joint NAND development and the potential for further collaboration in NOR Flash memory."
John Kispert, president and CEO of Spansion, said: "The joint NAND development activity and foundry agreement allows Spansion to efficiently expand its product offerings and bring additional value to our customers."
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