Qualcomm said that it is sampling the newly developed chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. The Mobile Data Modem MDM8220 supports dual-carrier high-speed packet access plus and the MDM9200 and the MDM9600 multi-mode chipsets 3G and Long Term Evolution (LTE).
The company said that it is working with network operators, infrastructure vendors and device manufacturers with its dual-carrier HSPA+ and/or LTE. It is also working with infrastructure vendors, such as Huawei Technologies and Nokia Siemens Networks, to perform interoperability tests for dual-carrier HSPA+ and LTE.
According to Qualcomm, the MDM9200 and the 9600 chipsets allow UMTS and CDMA2000 operators to upgrade to future LTE services while preserving backward compatibility to their existing 3G networks. While MDM9200 supports UMTS, HSPA+ and LTE, the MDM9600 supports CDMA2000 1X, EV-DO Rev. B, SV-DO, SV-LTE, UMTS, HSPA+ and LTE.
The company said that the chipsets also support FDD LTE and TDD LTE modes and different carrier bandwidths, and are capable of using orthogonal frequency division multiple access and multiple-input and multiple-output (MIMO) antenna technology to support peak data rates of up to 100Mbps on the downlink and 50Mbps on the uplink.
The MDM8220 dual-carrier HSPA+ is based on the 3GPP Release 8 standard, which provides peak downlink data rates of up to 42Mbps and 11Mbps on the uplink, allowing carriers to upgrade their existing infrastructure equipment to achieve higher bandwidths. Its dual-carrier technology doubles networks’ bandwidth from 5MHz to 10MHz by aggregating two HSPA carriers in parallel, Qualcomm said.
Alex Katouzian, vice president of product management at Qualcomm, said: Qualcomm leads the industry in enabling next-generation mobile experiences with highly integrated, powerful and elegant solutions for dual-carrier HSPA+ and LTE.
“We are pleased to be working with so many industry leaders to bring these advanced technologies to market. We remain committed to CDMA and OFDMA WAN modem leadership and the seamless and cost-effective commercialisation of next-generation technologies around the world.
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