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November 24, 2009

Infineon, Nokia team up on LTE development

Expects to drive interface standardisation for LTE-advanced enabling data rates of up to 1Gbit/s

By CBR Staff Writer

Chip maker Infineon Technologies and Nokia have announced a cooperation to develop advanced radio frequency (RF) transceivers.

The agreement covers a non-exclusive collaboration to ensure the compatibility and interworking of Nokia’s advanced licensable baseband modem technologies and Infineon’s leading RF offerings.

Under the agreement, Nokia and Infineon will work together to ensure that current and future generations of Nokia’s licensable modem designs work with Infineon’s RF transceivers, giving access to modem offerings for HSPA (High Speed Packet Access) through LTE (Long Term Evolution) and beyond.

Hermann Eul, member of the Infineon management board, said: “We are grateful to expand our successful collaboration with Nokia beyond our current platform and RF activities. Pairing Nokia’s advanced modem technology and Infineon’s best in class RF transceiver solutions, will give the industry access to very competitive chipset solutions.”

The companies said that the collaboration will involve teams from both companies working on the architectural and system challenges to ensure interoperability and compatibility. The result of the cooperation is expected to be a verified technology reference platform.

In addition, both companies will jointly drive the interface standardisation for LTE-advanced enabling data rates of up to 1Gbit/s. Providing a validated system with an open interface will enable a roll out of new products and increase competition in the market for advanced modem chipsets, the companies claim.

Pekka Sarlund, vice president for wireless modem at Nokia, said: “Taking advantage of each company’s expertise as leaders in their respective fields, this cooperation will help to deliver standard-based, industry leading solutions for mobile internet devices.”

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